Nanda Technologies designs, builds and markets highly sensitive (10µm up to 150nm), high throughput (up to 200wph) wafer inspection tools and modules for rapid defect signature analysis. The compact modules can be easily fitted in the loadports of a 300mm EFEM or integrated into cluster tools. It allows frontside, backside and edge meso and macro inspection across lytho, CMP, etch and CVD clusters. The inspection platform has no moving parts and does not require wafer alignments.